Model WRJF i9-A Solvent Less Laminating Machine Featured Image

Model WRJF i9-A Solvent Ishoma Laminating Machine

Tsanangudzo Pfupi

Muchina wekunyungudutsa-usingaverengeki welaminating (350m/min) wakakodzera kune akasiyana anochinjika epurasitiki firimu lamination basa seOPP/CPP,PET/PE,PA/PE,OPP/VMCPP, ine kukurumidza kukurumidza, inovhara nzvimbo diki uye tsvina yakavakirwa. mashandisirwo, anobata zvakanyanya kune yakakurumbira maitiro ekuchengetedzwa kwezvakatipoteredza mazuva ano.Chero mibvunzo, ndapota usazeza kubata .

Bag Material:Akasiyana-siyana laminated substrates seOPP/CPP,PET/PE,PA/PE,OPP/VMCPP, nezvimwewo.
Muenzaniso:1000/1300/1600
Max Laminating Width:1000/1300/1600
Max Laminating Speed:350m/min
Unwind/Rewind Diameter:Φ800/1000mm
Mold Temperature Control Machine:2Set
Optional Functions:Corona kurapa mudziyo

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Product Detail

Product Tags

Mhiri kweMembrane Chati

Applicable Industries

(Flexible Packaging Industry)

Substrate

BOPP	18-50µm
VMPET	12-30µm
PE	30-100µm
NYLON (NY)	15-30µm
PET	12-20µm
VMCPP	20-60µm
CPP	30-100µm

Machine Features

Kusanganiswa kweergonomics & girini yekurongedza tekinoroji
Fast yekuchenesa system
Yakananga yekupinza sisitimu yekupfeka uremu
Multi-ratio kudzivirira system

Coating gap memory system
Zero-error tension stabilization system
Precise coating uremu Detective system
Easy glue-kugadzirira system

Kudzora System

PLC (Schneider) uye kaviri-motor frequency conversion control
Yakaderera-mvura nhanho induction mudziyo kuti utange gluing
Pot A & Pot B fluid level / glue kushandiswa kunogara kuchionekwa
Yambiro yebasa rekuerekana / kusajairika shanduko yeiyo solvent-shoma glue ratio (mitsara-mitsara yambiro)
Schneider mhepo (break) switch + Schneider switch yemagetsi sosi + Schneider touch screen
Constant flow monitoring system
Schneider Frequency shanduko system